HGCAL Rentrée General Meeting August 2024

Intro and Overview:

HGCRocs:

v3b: ~1k chips (ordered more 25 wafer => 10% total this summer for module pre-production)
v3c: 30% (75 wafers) ordered end of 2024

The schedule is currently driven by HGCROC availability
If the HGCROC v3C recently submitted is satisfactory, will do 75 by end of year
unclear whether ROC3B is suitable for HDs
have to confirm the PLL radiation issue (not corrected in ROC3C) can be coped with for highly irradiated modules such as the 120um HDs

Irradiation of Partials
- C-Fiber likely to be ok for the CE-H
UCSB 5 LR-R modules with Ti baseplates (50Mrad irradiation planned)
Ideas for addressing ESD vulnerabliity:
- Shunt HV to GND for handling and module building, remove for testing – CERN/UMN looking into this –
- Encapsulate the exposed metal on the common mode capacitors. Has advantage that can easily be added as a step in the industrial final assembly.
Investigating new expoxy patter:
- No epoxy on the periphery near GR (noisy channels fix)
- Encapsulate exposed common mode capacitors on hexaboard with paths to HGCROC (ESD fix)
Schedule:
- Sep: Finish pre-series modules
- Oct: 2 modules per day x 1 week (one gantry tray)
- Nov-Dec: 4 modules per day x 1 week (one gantry tray)
- March 4 / day x 3 days (w/new trays)
- April 8/ day x 3
- May 12/day x 3

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